Microscale testing
We carry out on-chip tests, i.e. tests performed directly on the wafer with the mechanical parts for actuation and sensing built with the same micromachining process used for the MEMS.
Probe station with an optical microscopy (40x) and six micromanipulators
On-chip test to determine the Young’s modulus and the polysilicon strength: several different configurations where conceived and the mechanical properties were obtained from experimental measurements making use of FEM simulations and following a Weibull approach.
Rotational electrostatic actuator for on-chip bending tests: left) general view; right) detail of the bending specimen
«Equivalent» Young’s modulus for the thin polysilicon layer.
Parallel plate actuator for out of plane bending tests: (left) general view; (right) detail of one of the two specimens.
Probability of rupture: experimental values and identified curve